This lecture provides basic insights into process technology for producing integrated semiconductor components used in microelectronics. The primary focus lies on elucidating the specific procedural stages essential for chip manufacturing, including the materials and methods employed. Familiarity with the content covered in the "Fundamentals of Semiconductor Devices (Basic Studies)" lecture is advantageous as it serves as a foundational knowledge base. Consequently, this lecture forms the groundwork for the "Technology of Integrated Devices" course offered in the summer semester, which delves into the interplay among the various stages in chip fabrication. Continuing courses in this field are "Bipolar Devices," "MOS-Transistors and Memories," and the advanced "Semiconductor Technology Lab Class".
©
MBE 2020
Content
- Technology trends, process flows
- Wafer manufacturing
- Doping, diffusion, furnace processes
- Ion implantation
- Thermal oxidation
- Layer fabrication with atomic layer accuracy
- Pattern transfer (lithography)
- Back-end-of-line (contacting, wiring, planarization)
- Wet chemistry
- Etching
- in line metrology
- Analytics
- Packaging (testing, dividing, bonding, enclosing)
Dates and Materials
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Lecturer
Oberingenieur
30167 Hannover
Assistance
30167 Hannover